tem muita novidade essa semana. Confira os cursos e webcasts para essa quinzena.
consulte sempre um engenheiro eletrônico
18 – 22/02/2013 – How to Choose a Microcontroller – Curso pferecido pela Digi-key
This Track will help you understand the differences of the various markets, study specific microcontrollers and their tools, and discuss the semiconductor process technologies used to build microcontrollers.
The Track features lecturer William Giovino. William is Executive Editor of the popular web portal, Microcontroller.com, and an experienced semiconductor marketing leader with over 25 years’ experience.
- Feb. 18 | Day 1 – An Overview of the Microcontroller Marketplace
- Feb. 19 | Day 2 – Selecting an 8-bit Microcontroller
- Feb. 20 | Day 3 – Selecting a 32-bit Microcontroller
- Feb. 21 | Day 4 – Selecting a 16-bit Microcontroller
- Feb. 22 | Day 5 – Microcontrollers & System Considerations
The booming pace of outsourcing witnessed in the last decades appears to be slowing as manufacturers factor metrics like total cost of ownership into their outsourcing decisions. In cases, some are not only holding back on outsourcing and offshoring but are even pulling these back in-house.
It’s a fact – when it comes to embedded systems, some graphics implementations can’t fly in safety-critical applications. For an application to be DO-178B/C certified, all of its components must be certifiable. Adding to the challenge faced by designers are requirements such as determinism, SWaP, radiation hardening, and other that further limit possibilities.
Can the process be simplified? Yes! In this Webinar, experts explore cutting-edge technology for rendering OpenGL graphics entirely in software, allowing for their rapid integration into flight-ready and other safety-critical platforms. Starting with an introduction to OpenGL SC and ARINC 653 concepts, the discussion proceeds to how easily the software rendering engine is implemented, along with ideas for partitioned and distributed applications.
The USB protocol family is more important than ever with growing adoption of SuperSpeed USB (USB 3.0) and new USB protocols coming on line. However, these new capabilities have increased the difficulty of verifying USB designs. Cadence will present an overview of the challenges associated with verifying USB designs and methods for addressing those challenges with Verification IP (VIP).
Charged particle interactions with microwave electromagnetic fields is one of the most challenging areas of modeling, having to combine both field and kinetic methods in a simultaneous simulation. We select two microwave devices, magnetrons and striplines, from the VSim software’s full suite of electromagnetic and particle modeling capabilities to illustrate how this is done in practice.
Our speaker, David N. Smithe, Ph.D., of Tech-X Corporation, will discuss:
- Microwave source modeling, including device and simulation setup.
- User controls, visualization, and engineering diagnostics.
- Specific results from simulations of research and cooker-type magnetrons.
- Modeling of stripline and other microwave components for susceptibility to multipacting.
- Threshold determination, scattering coefficients, and trajectory visualization.
- Special techniques used by Vsim for quickly mapping out higher order multipacting.
- Examples of hybrid order multipacting, and other interesting phenomenon.
- VSimMD is optimized for solving large problems on parallel computing hardware.
In this webcast, we are proposing simulations hardened by measurements to detect the key enablers of the DDR3 and DDR4 memory channel. We will show an example of DDR3 memory channel running at 2.133GBps and how DDR4 technology can help us reach 2.4GBps.
In this webinar, we’ll explore the different bands of Military Communications including advantages and disadvantages for each. We will talk briefly about the shift toward Software Defined Radios (SDR) and what that means for system designers today. We will then talk about the Tx/Rx signal chains for these radios traditionally and where they are heading in the future including discussion on some of the key Analog and Mixed Signal technology driving these changes. Finally we will end with a brief discussion tying everything together.
What You’ll Learn:
- Understand the importance of high-quality lighting and good color rendering to the future success of LED-based lighting.
- Consider the significance of how the human visual system perceives colors, and how knowledge of that system can be applied in SSL product development and lighting design.
- Explore the fundamentals of color science and important metrics and characteristics including CRI, CQS, and SPD.
- Learn about the architectural approaches to SSL lamp and luminaire design that can deliver on the conflicting goals of warm CCT, high CRI, and energy efficiency.
Neste seminário, vamos revisar e realizar passo a passo:
- Como configurar a ferramenta de compilação (LTIB)
- Como compilar a BSP (Board Support Package)
- Como carregar uma imagem a um SD card e montá-lo na placa demo
- Como instalar o GStreamer e estar os codecs de vídeo
The global economic conditions are forcing many into redesign for differentiation, thus many companies are increasingly using international standards to ensure quality and high reliability. Reducing risks when developing safety critical software – is assisted by the use of pre-certified software components such as SAFERTOS. The SAFERTOS is a embedded Real Time Operating System from WITTENSTEIN high integrity systems which contains certification evidence contained within the Design Assurance Pack to smooth your path to achieving product certification.
Freescale and Green Hills Software have collaborated to deliver high-performance processor and operating system solutions for compute-intensive applications.
Freescale’s new QorIQ T4240 embedded processor (boasting the industry’s highest CoreMark® score for an embedded processor ) has 24 high virtual cores with vector processing, advanced power management, secure boot features and hardware support for virtualization.
Green Hills Software brings a proven history of expertise in leveraging these features with its INTEGRITY RTOS and multicore MULTI IDE to enable developers to build highly reliable, secure and performance-optimized embedded products in networking, industrial and military/aerospace markets.
Researchers at NASA’s Dryden Flight Research Center have patented a lightweight, fiber optics interrogation algorithm that can be used for real-time wing shape sensing, temperature, and strain measurements.
NASA’s fiber optic sensors are small, non-intrusive, easy to install, and provide high-resolution (0.5-inch) strain measurements that are much more precise than ever before. This critical, real-time monitoring capability detects changes during operation without affecting the intrinsic properties of the structure and without the need for structural modifications.
This session will cover the theory and practice for making phase noise measurements on clock signals as well as the relationship between phase noise and total jitter, random jitter and deterministic jitter. Measurements on a typical clock signal will be presented.
DDR4 has enabled memory designs to achieve new performance levels in enterprise, mobile, and personal computing applications. Accurately capturing and analyzing DDR4 memory traces is critical in bringing new products to market quickly. See the latest techniques for easily accessing signals and performing debug, turn-on, interoperability, validation and compliance testing of DDR4 based designs.
What You’ll Learn:
- How vision systems are being used for powertrain assembly inspection
- How advances in machine vision technology are affecting engine and transmission assembly
- The most significant aspects reviewed when simultaneously launching hundreds of cameras
- The future of machine vision in powertrain plants and a look at the most recent expansion of applications
Bonding high performance materials presents engineers with unique challenges to ensure immediate and long term interfacial adhesion success. Economic, environmental and productivity goals raise the stakes on the importance of finding the best solution when working with metals, polymers, adhesives, paints, coatings and other materials.
More manufacturing materials are coming from the polymer composite world, which then must be adhered to metals and other substrates. In-line plasma surface modification offers a solution that meets all of these requirements head-on.
This Webinar will provide engineers with insight on the latest surface modification technology applications and inspire them to adapt these new technologies to solve their own interfacial adhesion and delamination challenges.
Additionally all registrants will be entered to win an autographed copy of Rory Wolf’s new book Atmospheric Pressure Plasma for Surface Modification ($175.00 value)
25/28 Gb/s multi-lane designs will provide the foundation for next generation 100 Gb/s communications systems. Loss of critical performance margin due to measurement inaccuracy or misinterpretation of test standards can be painful and expensive. This seminar will provide critical insight into the root cause and elimination of measurement variation and degradation at high transmission rates. New simplified tools to achieve industry standard compliance will be presented.
Discover new products that accelerate the development of interface solutions that combine Renesas MCUs with new E Ink segmented display products. We will explain how to apply the segmented display technology and also describe tool features, benefits and use of these new types of displays. E Ink segmented displays are ultra-low power, thin and rugged.
Do you use Android as your real-time operating system for your devices? We’ve heard from several customers such as MIPS that managing Android Testing Cycles is one of the most challenging and time-consuming tasks in today’s Android Software Delivery process. Android Compatibility Test Suite (CTS) itself contains 17,000+ test cases and takes hours to run, often becoming the biggest bottleneck in the delivery process. In addition, device makers need to test multiple other test suites to cover the range of custom software that is incorporated into the devices.