Mini Curso e Webinários para essa semana

Publicado: 25 de março de 2014 em Webinários e Cursos
Tags:, , , , , , , , , , , , , , ,

Caro(a) Colega,

confira a programação de cursos e webinários para essa semana.




consulte sempre um engenheiro eletrônico


24 a 28/03/2014 – Mini Curso: Pick (& Implement) the Right PIC MCU

This lecture series will focus on developing hardware and firmware for various PIC MCU variants. Daily discussions will also involve the latest PIC development tools, which include C compilers, BASIC compilers, IDEs, and hardware programming/debugging devices. Garage-brewed applications will be mingled into every lecture day to support PIC microcontroller data sheet specifications and features.

  • March 24 – Day 1: Implementing PIC Serial-Based Peripherals
    Today’s lecture will focus on the real-world application of the various PIC microcontroller native serial peripherals. SPI, I2C, and USART hardware reference designs and their associated firmware drivers will be examined in detail.
  • March 25 – Day 2: The Multilingual PIC Microcontroller
    Although PIC assembler is still the programming language of choice in some projects, applications for the modern PIC MCU can also be forged using BASIC and C. Today’s discussion will focus on programming techniques involving assembler, PICBASIC Pro, CCS C, and Microchip’s X series of C compilers.
  • March 26 – Day 3: Embedded USB the PIC Way
    USB host and device designs are the lecture topics of the day. Today we will implement USB host and USB device hardware designs, which are entirely based on PIC microcontroller USB engines.
  • March 27 – Day 4: Embedded Ethernet the PIC Way
    A variety of scalable embedded Ethernet solutions are available. In today’s lecture we will implement a number of Ethernet hardware designs, which are based on Ethernet-enabled PIC microcontrollers and external MAC/PHY devices.
  • March 28 – Day 5: WiFi the PIC Way
    Today we will implement an embedded WiFi solution using a 32-bit PIC microcontroller and the Harmony development environment.

Digi-Key Continuing Education Center - IEEE - Design News


24/03/2014 – Reduce Automation Cost and Complexity with Virtualization Kit

New virtualization technologies are giving developers an opportunity to reduce the cost and complexity of industrial automation. Using multicore processors, developers can combine previously discrete subsystems into a single computing unit, thereby reducing the system’s footprint and streamlining integration, support, and maintenance.

In this webinar we will show how developers can take advantage of this technology with the Intel® Industrial Solutions System Consolidation Series – an off-the-shelf kit that accelerates delivery of high-performance, virtualized, real-time systems.

Attendees will learn:

  • The benefits of consolidation and the basics of virtualization technology
  • How Wind River Systems’ integrated software stack accelerates delivery of virtualized solutions
  • How distributors like Avnet can help machine builders, system integrators, and solution developers deploy the technology
  • Use cases such as motion control, programmable logic control (PLC), human machine interface (HMI), machine vision, and data acquisition.

Avnet Wind RiverIntel


25/03/2014 – Making Sense of DIY Options and Relevance to Embedded Apps

The Do it Yourself (DiY) craze started with techy hobbyists building robotics and sensor equipment with low cost, but high tech, platforms. The availability of these DiY platforms has exploded due to the very low cost of entry and software/operating systems that support these platforms. There are significant parallels between the DiY trends of today and the Linux trends of years gone by. The hobbyists using these DiY platforms are the same engineers developing embedded systems for a wide variety of industries. Can DiY make the jump from hobbyist platform to embedded production equipment? Join us as our DiY experts from the chip, board, and software segments discuss requirements, challenges, and solutions for DiY proliferation into embedded systems.

Enabling Exceptional User Experiences: The Importance of Embedded Storage for Smartphones and Tablets


25/03/2014 – Choosing and Testing smart cameras for your application

Smart cameras—rugged systems incorporating image sensors and processors—have evolved to become increasingly capable tools for machine vision. This webcast will guide viewers in the selection of smart camera hardware for applications such as inspection and verification, covering various functions and common features. It will explore software and support issues, and how to make sure a smart camera will operate effectively in your setup. For instance, it will discuss new self-testing features that analyze effectiveness of an application based on a library of parts. The webcast will conclude with a Q&A session that offers a chance for viewers to get help with their specific applications.

What You’ll Learn:

  • What current smart cameras offer to systems designers
  • How to select smart camera hardware
  • Important issues involving smart camera software and support
  • How to ensure that a smart camera will operate effectively in your system
  • What new self-testing features do and how they work


25/03/2014 – A Better Way to Measure Displacements and Strains: Optical Metrology for the Next Generation in Aerospace, Automotive and Micro-Electronics

ARAMIS is a true finite element measurement system that allows you to intuitively understand the material response of complex structures under test and directly validate detailed computer models. The PONTOS optical mobile measurement system provides 6-DOF (degrees of freedom) measurement of all types of structures, from wing flexure (NASA Dryden) to rocket motor vibration studies and modal analysis, all with the same hardware.

Our equipment can study everything from thermal expansion (using ARAMIS Thermography) to vibration and shock, with cameras running at up to 10M fps (frames per second). The data collected can then be used for everything from materials studies to manufacturing quality control reports.

This Webinar will teach you and your team all you need to know about this advanced measurement technology, as explained by the people who used it to study the ET fractures on Discovery’s last mission and validated the models for flight.


25/03/2014 – Engineering Live – The Internet of things – Mesa redonda ao vivo.

The Internet of Things (IoT) is no longer a buzzword used to sell trinkets with a simplistic app. Okay, it may still sell connected toothbrushes that record your brushing habits into a “health dashboard,” but in the next five years the IoT will impact every aspect of our lives, from home environment sensors that communicate, to maximize efficiency to wireless medical devices that communicate to maximize lifespan. This high demand technology is inescapable, and it uses innovative and, more importantly, inventive design to improve quality of life.

Our expert panel of IoT experts will be discussing:

• The current state of the industry.

• Where we’ll be in five years.

• The key componentry that is making it all possible.

ECN - Engineering live


26/03/2014 – Information Framework: The Key to Reducing Time and Risk

In today’s world of e-commerce, M2M, and cloud services, it’s critical for development and operational processes to embrace and account for these trends or risk failure.

Development processes for telecommunications typically include a mix of information and data models, internally developed software, and third party or open source software. Lack of common terminology and framework between the stakeholders in the process can cause delays, product issues, or even project failure. TM Forum is an industry association that has defined an information framework called SID that defines common terminology and provides a reference model for these processes.

Join experts from IBM and TM Forum to find out more about SID and how it can improve time to market, reduce cost and risk of integration, streamline development processes, and manage data and information more effectively.



27/03/2014 – How to Choose the Right Adhesives

Adhesives are a key component of more end devices than you can imagine. The applications range from simple industrial products at one end to mil-aero products at the end other end.

Attend this webinar and you will learn about:
Which type of adhesive is best for your application
What types of adhesive are available
How adhesives should be applied



27/03/2014 – Simulation-Measurement Workflow for DDR Compliance

DDR electrical compliance testing is required for memory controllers and DRAMs to comply with the JEDEC specification and to be interoperable among vendors.  The increasing demands of higher speed and density, lower power and cost present many challenges to DDR designers.  This webcast discusses Agilent DDR3 and DDR4 compliance test applications using both pre-silicon simulated waveforms and post-silicon measured waveforms, with emphasis on correlating simulation with measurement.  We will describe a methodology for simulating the full path from memory controller to DRAM solder ball.  A simulation-measurement correlation methodology called “Waveform Bridge” is discussed where DQ and DQS waveforms in both pre-layout and post-layout simulations are used to feed a DDR compliance test app.



27/03/2014 – Building a Smartphone-Class User Experience into Your Embedded Device

The proliferation of smartphones has raised expectations for user interfaces and wireless connectivity. It doesn’t matter whether you are creating a medical device, building automation system, vending machine, industrial controller, home appliance, or printer/copier, customers using your device will expect it to provide many of the same features they experience on their smartphones or gaming consoles — features such as 3D graphics, touch gestures, full audio-video, speech recognition, wireless connectivity, and even cloud connectivity. Nonetheless, the system-level integration required for achieving this rich user experience can be very complex. In this session, we’ll identify many of the components and techniques for achieving this integration successfully.



28/03/2014 – Use of Symbolic Computation Techniques in Controller Arm for World’s Largest Functional Brain Model

Spaun, the world’s largest functional model of the human brain, has a digital eye, which it uses for visual input, and a robotic arm that it uses to draw its responses. Having a realistic arm that behaves similarly to an actual arm, with appropriate muscle responses and arm segment lengths and mass, is important to getting accurate results. Researchers attribute the success of the complex arm model to the symbolic computation power and model simplification capabilities of the modeling technology they are using.

This 30-minute Webinar will explain how the symbolic equations generated enabled very accurate descriptions and extensive analysis of the model. This, in turn, led to a highly efficient simulation of the controller arm, and precise evaluation of how different scenarios affect the output of the brain system.

Deixe um comentário

Preencha os seus dados abaixo ou clique em um ícone para log in:

Logotipo do

Você está comentando utilizando sua conta Sair /  Alterar )

Foto do Google

Você está comentando utilizando sua conta Google. Sair /  Alterar )

Imagem do Twitter

Você está comentando utilizando sua conta Twitter. Sair /  Alterar )

Foto do Facebook

Você está comentando utilizando sua conta Facebook. Sair /  Alterar )

Conectando a %s