Treinamentos para essa semana

Caro(a) Colega,

confira os treinamentos programados para essa semana.




consulte sempre um engenheiro eletrônico


19 – 23/05/2014 – Mini curso: Programming Embedded Systems in C++

Most embedded systems are programmed in C but there has been much market research that has indicated that a transition to C++ is likely to occur. However, that transition has been slow and that tardiness is caused by a number of factors, one of which is an understanding of the benefits of the language to the embedded developer. This series of classes will look at all aspects of C++ for the embedded developer, including:

  • A review of the particularly useful language features
  • Advice on making the transition from C
  • Some ideas about C++ and its interaction with a real time operating system
  • Practical case studies

This course features lecturer Colin Walls. Colin has over 30 years of experience in the electronics industry, largely dedicated to embedded software. He is the author of two books on embedded software and numerous technical articles. Based in the UK, he is an embedded software technologist with Mentor Embedded.

Digi-Key Continuing Education Center - IEEE - Design News

20/05/2014 – Power Management Semiconductor Market Outlook

This Fairchild sponsored webinar will present an overview of the power management IC market and the technologies that drive it. Topics include applications in smart homes and cities, automotive systems, LED lighting, and industrial systems.

Key Take-Aways:

  • Learn about the future of the power management semiconductor market.
  • Understand the technological and market opportunities for major players in the power management semiconductor market.
  • Explore the issues related to implementing power management in low-power systems.

Visit IHS GlobalSpec to register.



21/05/2014 – Reliability Solutions of Flash Products and SSD – ATP Reliability and Power Protector

Due to the increased density with each new Flash generation, problems such as limited program/erase cycles, read cycles and data retention are becoming more apparent, requiring more advanced NAND Flash reliability solutions.
ATP will discuss major reliability concerns resulted from the inherent nature of Flash products, and how ATP’s reliability solutions can help extend the longevity and product life cycle of ATP flash products.



22/05/2014 – Eliminating DRAM from HMI Systems

In this seminar, we will discuss how several megabytes of on-chip RAM embedded inside an ARM Cortex-A9 based microprocessor (MPU) can supercharge your HMI system. We’ll show you how to reduce cost and board space by eliminating SDRAM and how to achieve higher performance per unit cost by leveraging the highly parallel memory architecture inside a Renesas RZ/A MPU. We will also discuss how real-time operating systems (RTOSs) can simplify and add flexibility to your design experience.

Attendees Will Learn:

  • How to save board space with the Renesas RZ/A MPU
  • How to avoid DRAM procurement issues by using the Renesas RZ/A MPU
  • How the Renesas RZ MPU lets you achieve higher performance at lower frequencies versus executing from external DRAM due to an advanced on-chip memory architecture that maximizes performance per unit frequency, cost, and power

Renesas Electronics's logo


22/05/2014 – Simultaneous Switching Noise Analysis in DDR4 applications using Power-Aware IBIS Models

Simultaneous Switching Noise (SSN) analysis is very important in designing the next generation of memory (and serial) interconnects. This tutorial discusses DDR4 applications and showcases a methodology to do the SSN analysis which can help identify problem areas, debug issues and optimize the design. Touchstone v2.0 model format is utilized to create an SI/PI combined model and then used in Transient (SPICE) simulations for better accuracy. Also Power-Aware IBIS v5.0 models are used to represent the non ideal power effects on the memory controller side. Various setups and results using ADS 2013.06 will be showcased.


22/05/2014 – Heat Transfer Simulation in Materials Processing

Engineers in the aerospace, defense, heavy manufacturing, automotive, and medical product industries develop processes to produce materials with specific mechanical and physical properties.
In this webinar, we will demonstrate the analysis of conjugate heat transfer problems in COMSOL Multiphysics that are relevant to material processing, and investigate the effects of fluid flow on the quenching of hot components. The analyses show the effects of conduction, convection and radiation for sufficiently high processing temperatures.
The webinar will conclude with a Q&A session.


Deixe um comentário

Preencha os seus dados abaixo ou clique em um ícone para log in:

Logotipo do

Você está comentando utilizando sua conta Sair /  Alterar )

Foto do Google

Você está comentando utilizando sua conta Google. Sair /  Alterar )

Imagem do Twitter

Você está comentando utilizando sua conta Twitter. Sair /  Alterar )

Foto do Facebook

Você está comentando utilizando sua conta Facebook. Sair /  Alterar )

Conectando a %s