Posts com Tag ‘Embedded Intel Solutions’

Caro(a) Colega,

confia as novas edições das revistas:

August 2014 Laser Focus World - August 2014 Embedded Intel Solutions - August 2014 Design News - August 2014 -  eletricidade Moderna - Julho 2014 Electronic Products - August 2014 MIlitary Embedded Systems - July / August 2014  The PCB Magazine - August 2014




consulte sempre um engenheiro eletrônico

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confira as novas edições das revistas abaixo.

Boa leitura! Abraço,



consulte sempre um engenheiro eletrônico



appliance DESIGN Bodo's Power Systems - April 2014 Control Design Magazine - April 2014 Design News Electronic Design - April 2014 Electronic Products - April 2014 Embedded Intel Solutions - April 2014 Machine Design - April 2014 IEEE Spectrum - April 2014 Printed Circuit Design & Fab - April 2014 Product Design & Development - April 2014 Automotive Engineering:  April 1, 2014 Aerospace & Defense Technology: April 2014 SAE Off-Highway Engineering: April 3, 2014 The SMT Magazine Vision Systems Design - April 2014 The PCB Magazine - April 2014 Electrónica & Comunicaciones - 289

Caro(a) Colega,

confira as novas edições das revistas abaixo:

Embedded Intel Solutions - October 2013 Designspark Magazine Issue 3 Embedded Computing Design - October 2013 Evaluation Engineering - November 2013 New Electronics - October 22 - 2013 Product Design & Development - October 2013 Military Embedded Systems - October 2013 Electrónica & cominucaciones - nº 287 Security & Counterfeiting October 2013

Boa leitura! Abraço,


consulte sempre um engenheiro eletrônico

Caro(a) Colega,

essa semana começou “recheada” de revistas:

Intel Embedded Solutions - August 2013 Microwaves & RF Military & Aerospace - August 2013 Product Design & Development - July/August 2013 The PCB Design Magazine - August 2013 EP Special August 2013 Electronic Products - August 2013 ED Europe August PC&Industrie9-2013 HF-Praxis9_2013 Digital Engineering - 06 Elektronik Praxis - nº 15    Mecatrônica Atual 61

Boa leitura. Abraço,


consulte sempre um engenheiro eletrônico

Caro(a) Colega,

confira os treinamentos programados para essa semana. Também atualizei os cursos programados para maio da ABNT e uma nova revista para a nossa estante virtual. a Embedded Intel Solutions.

Embedded Intel Solutions - Spring 2013



consulte sempre um engenheiro eletrônico


 A partir de 30/04/2013: Roadshow: Substituindo Microcontroladores de 8Bits por 32Bits – ARM cortex-M0+ (Kinetis L Freescale)

Instrutor: Microgenios


  • 10 de Abril – São Paulo (SP)
  • 30 de Abril – Porto Alegre (RS)
  • Maio – Curitiba (PR)
  • Maio – Florianópolis (SC)
  • Maio – Caxias do Sul (RS)
  • Maio – Belo Horizonte (MG)
  • Maio – Brasilia (DF)
  • Junho – Recife (PE)
  • Junho – Sta. Rita do Sapucai (MG)
  • 20 de Junho – Campinas (SP)

Conteúdo Geral do Treinamento

O Road Show Microcontroladores ARM cortex-M0+ (Kinetis L Freescale), é um projeto realizado em parceria pela a Freescale e a Microgenios, que viabilizou a realização de treinamentos de curta duração (5h) em 10 cidades espalhadas pelo Brasil, de modo que os desenvolvedores de todas as regiões do país, possam conhecer esta nova família de dispositivos da Freescale e as vantagens de seu uso para o desenvolvimento de projetos e aplicações que antes utilizavam apenas microcontroladores de 8Bits.

HandsOn Microgenios


06/05 a 10/05/2013 – Introduction to Medical Electronics

This Track will introduce you to Medical Electronics and covers the basics of designing embedded systems for medical applications. It will provide a brief overview of the unique characteristics of medical electronics, concentrating on the sensing and measuring of biometric values.

The Track features lecturer Charles J. Lord, P.E., an embedded systems consultant and trainer with over 30 years of experience in system design and development in medical, military, medical, and industrial applications. He is also specialized in the integration of communication protocols into client’s products, including USB, Ethernet, and low-power wireless including ZigBee.

Courses include:

  • May. 6| Day 1 – Executive Overview: Introduction to Medical Electronics
  • May. 7| Day 2 – Medical Device Safety, Reliability & Regulatory Issues
  • May. 8| Day 3 – Medical Device Communications, Part 1
  • May. 9| Day 4 – Medical Device Communications, Part 2
  • May. 10| Day 5 – Medical Data Storage

Design News Continuing Education Center


07/05/2013 – Optimizing the quality of experience (QoE) for mobile devices using IP analysis

Latest forecast data estimates 1 billion smartphones will be used by the end of 2013. Likewise, tablet PCs continue to replace desktop PCs. With the increase of such personal mobile devices, the popularity of third-party-applications, mobile apps, is strongly growing. However, each of these apps establishes its own communications link to the Internet. Knowing that data performance based on UMTS/HSPA, CDMA2000® and certainly LTE has been greatly enhanced over recent years, it is essential to understand the impact of these applications on the end-user quality of experience (QoE). This webinar will illustrate the implication of applications installed on a smartphone or tablet PC in terms of number of IP connections, list of protocols including protocol name resolution, TCP performance and data volume statistics. It further outlines how QoE can be optimized by applying IP analysis and protocol statistics functionality using leading test and measurement solutions from Rohde & Schwarz.

Attendees will learn:

  • Implications of active applications running on a smartphone/tablet PC
  • How to analyze the number of IP connections, the used protocols, and the amount of data related to different applications
  • How to use TCP analysis to optimize TCP throughput e.g. used with file transfer protocol (ftp)

Rohde & Schwarz


07/05/2013 – PCI Express 3.0 Compliance Successfully Navigating the Standard

PCI Express ® is the I/O technology of choice in high performance desktop and server applications. PCIe technology offers the benefits of reduced power consumption, scalability of bandwidth, increased data throughput and improved signal integrity. PCI Express signaling is continuing to deliver segment leading performance and data throughput, currently operating at 8GT/s and soon moving to 16GT/s. Increasing its data rate to 8GT/s, PCI Express 3.0 presents many new challenges to the industry. For example, at 8GT/s places a significant burden upon the physical channel, transmitter, and receiver. Signal integrity, while important with all generations of PCI Express technology, becomes a crucial component of any PCIe 3.0 design. and signal integrity design and validation. In addition, the migration to a 128/130 bit encoding scheme for PCIe 3.0 creates additional challenges in physical layer validation as well as logical validation.

This presentation will provide you with an overview of the latest developments in the PCI Express 3.0 standard, including new methods for validating transmitter jitter, transmit de-emphasis and preshoot, equalization parameters, and the effects of de-embedding on PCI Express compliance measurements. We will also discuss key considerations for receiver jitter stress testing at both the component and system level. Lastly, this presentation will provide instruction on how to accelerate PCI Express 3.0 testing using a 26GHz high speed switch to multiplex your DUT signals into your test instrumentation.



07/05/2013 – Case Study: Design and FPGA-Prototyping of an Application Specific Processor for Embedded Vision

Computer vision algorithms are typically both compute-intensive and memory-bandwidth-intensive. Plus these algorithms are evolving quickly, calling for a software-programmable implementation. To achieve real-time performance while staying within the available power budget, application specific processors (ASIPs) are an alternative choice, as standard CPUs and GPUs often have to be ruled out for performance and/or power-efficiency reasons. When designing a processor-based SoC, FPGA prototyping is a key element in the design flow, as it allows HW/SW validation, real-time video inspection of the functionality, and debugging of memory interfaces often not captured during the simulation stages.



08/05/2013 – Tools and Techniques for effective development of automotive software systems

Automotive systems development has evolved into an intricate blend of safety-critical software systems, infotainment, and connectivity. Literally hundreds of software components and subsystems are involved that run on a variety of processors and architectures within the auto. Managing these myriad of sub-systems within this environment can be very complex. Critical steps to a successful development cycle include:

• Effective requirements tracking
• Efficient collaboration across development teams
• Early emulation testing to identify potential problems



08/05/2013 – Mastering Distributed Control with fully Integrated Systems

Large multi-axis or multi-process machines often benefit from additional controllers operating local processes while a main controller coordinates the efforts for the entire machine. In these cases, the additional controllers may need enough processing power to handle multi-axis motion as well as localized I/O.

Instead of the headache of piecing together components, boards for drive and controls, and typical wiring, fully integrated system solutions already exist and can be customized for your specific application. Advanced applications examples include autonomous vehicles, motion profile phasing and offsets, quick tool change-out, extreme high-axis count applications such as flexible tooling, traverse and take-up winding and self-guided solar panel applications.



08/05/2013 – The Vivado Design Suite 2013.1—Accelerating Time to Integration and System-Level Design

Accelerating the development of smarter systems requires levels of automation that go beyond RTL level design. With the introduction of the Vivado™ Design Suite, Xilinx delivers a SoC-strength, IP-and system centric, next generation development environment that has been built from the ground up to address the productivity bottlenecks in system-level integration and implementation.



09/05/2013 – Achieving Predictable and Highly Reliable 10G Backplane Designs

This webinar explores the challenges of implementing 10 Gbps backplane systems, which can include PCB traces of 30″ or longer with multiple connectors. Highly reliable 10G backplane systems require bit error rates (BER) better than 10-12, which goes beyond the base specification of most standards. To understand the challenges and options, the webinar will walk through a system case study and present representative channels. It will explore the architectural and circuit techniques required to meet stringent requirements, including the trade-offs associated with PLL implementation and receiver equalization.