Posts com Tag ‘webinários’

Caro(a) Colega,

inicia-se na segunda-feira um curso com 5 dias de duração, sobre a utilização da fusão de dados fornecidos por diversos sensores em embarcados, oferecido pelo CEC – Continuing Education Center numa parceria entre o IEEE, o site de conteúdo Design News e patrocinado pela Digikey. Confira a resenha:

The use of multiple, heterogeneous sensors is often necessary in the case of robot control, autonomous vehicles and military aviation. Different skills are required, including electrical engineering, computer science and statistics. These systems can be complex and include many control theory concepts. In this class series, we will look at the sensor fusion problem, discuss the available algorithms, and examine the types of sensors available using examples as illustration.

Aproveite! Clique na figura a seguir para fazer a sua inscrição ou obter mais informações.

Abraço,

Henrique

consulte sempre um engenheiro eletrônico


Multi-Sensor Fusion

Caro(a) Colega,

hoje inicia-se um curso com 5 dias de duração, sobre projetos e lançamentos de produtos embarcados, oferecido pelo CEC – Continuing Education Center numa parceria entre o IEEE, o site de conteúdo Design News e patrocinado pela Digikey. Confira a resenha:

Designing and launching an embedded product is by no means an easy feat. At every turn, development teams are faced with challenges ranging from business and marketing all the way through the design and implementation of the actual product. Today’s development environment can be extremely challenging given the rapid pace at which technology is advancing including the growth of IoT and AI. In this series, we are going to look at the challenges facing teams that are looking to launch a product and explore the best practices teams need to be successful. We are going to mainly focus on the technical challenges and how to overcome them but will also touch on the business and marketing aspects that are required in order to be successful.

Aproveite! Clique aqui para fazer a sua inscrição ou obter mais informações.

Abraço,

Henrique

consulte sempre um engenheiro eletrônico


Caro(a) Colega,

a partir do dia 22 inicia-se um curso com 5 dias de duração, sobre projetos de controladores industriais baseados em microprocessadores, oferecido pelo CEC – Continuing Education Center numa parceria entre o IEEE, o site de conteúdo Design News e patrocinado pela Digikey. Confira a resenha:

Industrial controllers at the device level have a long history. Over time they have evolved from relay based, to discrete logic and finally to microprocessor-based logic. While the functions have remained the same, the capabilities and sophistication have grown enormously. In this class, we will look at the history and development of the field, as well as the modern architectures which are currently in use. We will take a deep dive into several examples of controllers, including the algorithms and implementations for several. Finally, we will look at connectivity and trends in the industry.

Aproveite! Clique aqui para fazer a sua inscrição ou obter mais informações.

Abraço,

Henrique

consulte sempre um engenheiro eletrônico


Caro(a) Colega,

a partir do dia 10 inicia-se um curso com 5 dias de duração, sobre projetos de sistemas embarcados utilizando MicroPython, oferecido pelo CEC – Continuing Education Center numa parceria entre o IEEE, o site de conteúdo Design News e patrocinado pela Digikey. Confira a resenha:

Designing Embedded Systems Using MicroPython 

The C/C++ programming languages have long dominated the embedded systems industry, with very few other languages being able to find a foothold. The winds of change are upon us, however, and MicroPython may be the programming language you use to build your next product. Python’s shallow learning curve and the fact that even elementary-school students are learning how to use it is positioning it to be a dominant language in the next half-century. In this course, we will examine how to use MicroPython to develop products and point out the little “gotchas” and learning points that can often be stumbling blocks to developers. Attendees will walk away from this course with a detailed understanding of what they need to do in order to use MicroPython in their next product.

MicroPython offers developers an interesting and unique strategy to rapidly accelerate product development by leveraging existing libraries and hardware modules to develop a product. In this session, we will examine what tools are available to developers and help them to understand the ecosystem surrounding MicroPython, which includes development boards, modules and software.
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A critical component to accelerate development in any embedded system is to leverage existing modules and libraries to accelerate design. The PyBoard D-Series development board can be leveraged by designers, not just to prototype their systems, but to also be used in production systems. In this session, we will fire up the Pyboard D-Series module and look at how we can interface to it to write our first MicroPython scripts. Attendees will walk away with a better understanding of how to use the available software libraries.
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A production-intent system may require that developers make modifications to the MicroPython kernel and recompile it themselves. Developers may want to do this to protect their own IP modules, to improve the robustness of the kernel, or to customize the start-up sequence. In this session, we will examine how developers can do just that.
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The Python language provides developers with many libraries and language features. Still, not all features will necessarily work on an embedded target as one might expect. In this session, we will look at how we can develop real-time applications using simple schedulers and the built-in Python threads class. Attendees will walk away with an understanding of real-time Python and how it works in a resource-constrained environment.
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Testing is an important piece of production system development. There are many ways that developers can test their MicroPython code and one interesting way is to create a test harness. In this session, we will explore different test-harness schemes and show how they can be used during development to ensure that the MicroPython code is working as expected. We will also discuss robust coding techniques in Python before reviewing the week’s course and discussing how developers can go further with MicroPython.

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Aproveite! Clique aqui para fazer a sua inscrição ou obter mais informações.

Abraço,

Henrique

consulte sempre um engenheiro eletrônico


Caro(a) Colega,

semana que vem temos os treinamentos destacados a seguir. Aproveitem!

  • 29 / 05 / 2019 – How To Design With Bluetooth Mesh
  • 29 / 05 / 2019 – Novas tecnologias de conectividade para IoT: LTE CAT M1 e LTE NB-IOT – Diferenças e vantagens
  • 29 / 05 / 2019 – Robust, Lightweight Protection for Challenging Harsh Environments using Parylene Conformal Coatings
  • 30 / 05 / 2019 – Automotive EMI Reduction Techniques, Applications and Solutions
  • 30 / 05 / 2019 – How to Easily Build Functional Safety into Your Automotive Cluster Design

Abraços,

Henrique

consulte sempre um engenheiro eletrônico

29 / 05 / 2019

How To Design With Bluetooth Mesh

How To Design With Bluetooth Mesh

An Electronic Design hosted Live Broadcast Webinar, sponsored by Mouser Electronics and Cypress

Apr 15, 2019

Date: Wednesday, May 29, 2019
Time: 11:00 AM Eastern Daylight Time
Sponsor: Mouser Electronics and Cypress
Webinar Type: Live Broadcast Webinar
Duration: 2 Hours

Register Today!

Summary:

Bluetooth® mesh is a low-power, wireless network with many-to-many node communication for large-scale, extended range networks.  Bluetooth Mesh enables new use cases and applications ranging from building automation to asset tracking. Cypress, a leader in wireless connectivity, was the first to introduce a Bluetooth SIG-qualified mesh solution that is in end-customer production.  Cypress has also recently introduced an ultra-low power Bluetooth 5 MCU, the CYW20819, that has been fully Bluetooth Mesh 1.0 qualified. We invite you to join Cypress’s own Alan Hawse (@askiotexpert) for a hands-on, technical training on how to design with Bluetooth Mesh.  In this virtual experience, Alan will take attendants through, step-by-step how to implement Bluetooth Mesh applications.

To follow along, participants of this training are encouraged to purchase a  CYW20819 Bluetooth Mesh Evaluation Kit (CYBT-213043-MESH)  from Mouser and download and install the ModusToolboxTM development suite.

The CYW20819 Bluetooth Mesh Evaluation Kit contains 4 mesh node boards to get you started with your Bluetooth Mesh application. Attendees that stay to the end of the training will be entered for a chance to win some Cypress Bluetooth Mesh enabled Sylvania SMART+ Light Bulbs!

Speaker:

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Alan Hawse, Senior Vice President and Fellow, Cypress Semiconductor

Alan Hawse has served in multiple roles at Cypress since 1991, from managing design tools, corporate IT, software tools, executive board member, Customer Experience, and most recently leading the global Applications and Software Engineering Groups in the MCU/Wireless Business Unit at Cypress. Additionally, he is passionate about technology, education and is a Maker and avid technology blogger on his website www.iotexpert.com. Alan teaches microcontroller and IoT development to customers, Cypress employees and makers of all ages using Cypress’ MCUs, connectivity solutions and software tools like PSoC Creator, the WICED SDK and ModusToolbox IDE. He lives in Kentucky, enjoys hoppy beer, Bourbon, perfectly roasted and extracted espresso and bicycling.

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Novas tecnologias de conectividade para IoT: LTE CAT M1 e LTE NB-IOT – Diferenças e vantagens

LTE CAT M1 e LTE NB-IOT

Resumo do Webinar

Serão apresentadas as alternativas atualmente disponíveis para conectividade de dispositivos IoT (LoRA, SIGFOX, LTE CAT M1, LTE NB-IOT (1 e 2)), comparando as principais características de cada tecnologia, as melhores alternativas de aplicação das mesmas e em que situação é melhor usar qual tecnologia.

Além disso, será apresentada a infraestrutura disponível hoje no Brasil para cada tecnologia e o roadmap das operadoras para as alternativas apresentadas.

Convidados

Neimar Marques Duarte

Engenheiro eletrônico com experiência no desenvolvimento de hardware para sistemas baseados em FPGA. Atua como engenheiro de aplicações da Altera na Macnica DHW LTDA e com desenvolvimento de projetos eletrônico, consultoria e treinamentos na área de FPGA.

REGISTRO


Robust, Lightweight Protection for Challenging Harsh Environments using Parylene Conformal Coatings

May 29, 2019 at 1:00 PM EDT / 12:00 PM CDT / 10:00 AM PDT / 5:00 PM GMT

Sponsored by:

 


Webcast Description:

The electronics, aerospace, defense and oil & gas industries have long utilized conformal coatings to protect products from their surrounding environments. As technologies continue to progress, they are required to survive long-term exposure to very harsh environments, including the depths of space, years of widespread thermal cycles between land and air, harsh chemical and temperature exposure, and more. Many conformal coatings struggle to provide durable, lasting protection.

For over 45 years, Parylene conformal coatings have substantially enhanced the reliability of numerous devices and parts, including circuit boards, sensors, MEMS/semiconductor products, LEDs, implantable medical devices, and elastomeric and metal components, that are used in a wide array of applications and environments.
This webcast will offer an opportunity to learn more about Parylene conformal coatings – the coating process, applications Parylenes protect today, and the properties and benefits they can offer products, including:

  • Thin, lightweight protection
  • Truly conformal coverage, with no air-gaps or voids
  • Excellent moisture and chemical barrier
  • High dielectric strength
  • Thermal stability up to 350°C long-term (450°C short-term)
  • Waterproofing capabilities per IPX testing
  • Lubricity/low coefficient of friction

The webcast will also introduce a new Parylene variant – halogen-free ParyFree®, and will discuss advances in adhesion technologies and the role Parylene plays in advanced micro and nano-level technologies.

As applications, materials and technologies evolve, lightweight robust Parylene coatings will continue to safeguard and add value to technologies around the world.
Register for this webcast and learn more!


Presented by:

Tim Seifert
Aerospace & Defense Market Manager
Specialty Coating Systems

 

Rakesh Kumar
Vice President of Technology
Specialty Coating Systems, Inc.


30 / 05 / 2019

Automotive EMI Reduction Techniques, Applications and Solutions

Automotive EMI Reduction Techniques, Applications and Solutions

Apr 23, 2019

Date: Thursday, May 30, 2019
Time: 11:00 AM Eastern Daylight Time
Sponsor: Texas Instruments
Duration: 30 Minutes

Register Today!

Summary:

The world is hurtling towards Electric Vehicles and Autonomous Cars. Semiconductor content of cars is expected to increase ~ 10x by 2025. In this presentation we show challenges in EMI for new increasing demanding automotive systems like ADAS, cameras, instrument cluster and infotainment. We will discuss EMI mitigation techniques like filtering, spread spectrum and E-field shielding and compared the results.

This session will cover:

  1. EMI noise sources and near E-Field coupling
  2. EMI mitigation techniques, like switch node shaping, spread spectrum, and E-Field shielding techniques

Speakers:

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Robert Loke, Validation Engineer, Texas Instruments

Robert Loke is a validation engineer in the Texas Instruments buck switching regulators group and a part of the Member Group, Technical Staff. Robert has conducted over 7 years of research in autonomous mobile systems and medical and has over 13 years of experience in the semiconductor industry focusing on power. His expertise is in product definition and strategy, systems, applications and validation.

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Robert Blattner, Senior Application Engineer, Texas Instruments

Robert Blattner is a senior application engineer in the Texas Instruments buck switching regulators group. Robert has over 35 years of experience in the semiconductor and consumer electronic industry and a MEE from Rice University. His expertise is in device design, system and product definition, systems and applications.

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Register


Event Banner

Summary

Title:  How to Easily Build Functional Safety into Your Automotive Cluster Design

Date: Thursday, May 30, 2019

Time: 9:00 am PDT | 12:00 pm EDT | 6:00 pm CEST

Fully programmable instrument clusters are becoming common in automobiles across varying price categories. This presents a significant challenge for developers of instrument cluster graphics. Where once an analog instrument cluster displayed mission-critical information like warning signs and PRNDL status, now the same information needs to be represented on a digital display.

This webinar explores the challenges associated with implementing high-resolution digital instrument cluster displays, and the tools needed to to meet the ISO 26262 standard for safe boot, complex embedded algorithm processing, and functional safety diagnostics. We’ll show you how to ensure fail-safe performance of instrument cluster graphics, and present examples of cost-effective solutions that OEMs and Tier-1 manufacturers are using to successfully implement safe instrument clusters for production.

Attendees will learn:

  • Functional Safety 101: The automotive instrument cluster challenge
  • Automotive-proven solution for ISO 26262-compliant automotive displays
  • A breakdown of this solution architecture—from tools to hardware
Can’t attend the live event? We’ve got you covered! Register now, and we’ll send you a link to view the webinar on-demand after the live broadcast.

Caro(a) Colega,

a partir do dia 20 inicia-se um curso com 5 dias de duração, sobre soluções de conectividade para a internet industrial das coisas, oferecido pelo CEC – Continuing Education Center numa parceria entre o IEEE, o site de conteúdo Design News e patrocinado pela Digikey. Confira a resenha:

The Industrial Internet of Things (IIoT) consists of components and systems that connect industrial equipment together and potentially link them to external systems.  These are distributed systems that may span a great area inside an individual facility and may even connect to other facilities.  In some cases, external systems are added to the mix to facilitate control and analysis of data.  In this course, we will look at the communication components,  and discuss how they are interconnected and architected. 

    • May 20 – Day 1 – IIoT Landscape – In this lecture we shall introduce the IIoT and how it is used. An understanding of the basic components in play will be given with an eye toward understanding how they may need to communicate and what those requirements might be
    • May 21 – Day 2 – Wired Options – Interconnection between industrial components has long been accomplished using various wired technology solutions. Many of these are still in use and valuable today. In this lecture we will give an overview of those options, including their capabilities and applicability.
    • May 22 – Day 3 – Wireless Options – As wireless technology has improved, the ability to use it in an industrial setting has presented itself. In addition, wireless technologies can be easier to install and maintain. We will look at the technologies in use and how they are adapted in industrial situations. 
    • May 23 – Day 4 – Architectures for Individual Plants – The traditional and main use for the IIoT was to connect devices within a single industrial plant or facility. As many of the facilities contain interconnected devices in large physical areas, it is important to plan the layout and architecture of the communications. These architectures must be  flexible and amenable to growth and reconfiguration.  In this class we will look at the ways in which that may be done. 
    • May 24 – Day 5 – Distributed Operations and External Connections – Many operations in modern industrial enterprises have multiple facilities, including warehousing and distribution sites.  These will have many devices internally and will need to work together.  This can be done by direct connection, or by integration with centralized computing resources, often including cloud computing and storage.  The centralized systems will perform operations such as Manufacturing Resource Planning (MRP) and analytics.  Data transmitted between plants and central facilities can present many challenges.  In this lecture we will discuss how these are met and how to implement them. 

Aproveite! Clique aqui para fazer a sua inscrição ou obter mais informações.

Abraço,

.

Henrique

consulte sempre um engenheiro eletrônico

Caro(a) Colega,

a partir do dia 27 inicia-se o curso sobre a criação de plataformas de sensores baseados em microcontroladores ARM , oferecido pelo CEC – Continuing Education Center numa parceria entre o IEEE, o site de conteúdo Design News e patrocinado pela Digikey. Confira a resenha:

Each day of this lecture series will detail the creation of a sensor platform based on an ARM microcontroller. Prototypes and reference designs discussed in the lectures use Digi-Key off-the-shelf components and can be easily customized to meet the attendee’s specific design goals.

Aproveite! Clique na figura a seguir para fazer a sua inscrição ou obter mais informações.

Abraço,

.

Henrique

consulte sempre um engenheiro eletrônico


ARM your sensores